LOTTE EVA VA900 is a high-VA, high-melt-flow EVA copolymer designed primarily for hot melt adhesive applications. Its 28 wt.% vinyl acetate content provides relatively high polarity and flexibility, while its MFI of 150 g/10 min enables excellent melt flow and efficient processing.

The combination of adhesion, flexibility, melt flow, and processing efficiency makes VA900 a suitable base polymer for a range of hot melt adhesive formulations, including selected packaging, bookbinding, woodworking, textile, carpet, and industrial adhesive applications.

Key Product Specifications of EVA VA900

Property

Typical Value

Test Method

Vinyl Acetate Content

28 wt.%

LC Method

Melt Flow Index

150 g/10 min

ASTM D1238

Density

0.950 g/cm³

ASTM D1505

Shore D Hardness

21

ASTM D2240

Melting Point

67°C

LC Method

Vicat Softening Temperature

<40°C

ASTM D1525

Primary Application

Hot Melt Adhesives

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Important Uses of LOTTE VA900

  1. Packaging Adhesives. LOTTE EVA VA900 can be used as a base resin in hot melt adhesives for paper, paperboard, cartons, and selected packaging structures. Its high melt flow supports efficient melting and application during continuous packaging processes.
  2. Bookbinding Adhesives. Its flexibility and melt processability make VA900 suitable for selected hot melt adhesive formulations used in bookbinding and related paper-converting applications.
  3. Furniture and Woodworking Adhesives. VA900 can be incorporated into hot melt adhesive formulations for selected furniture assembly, edge-banding, and woodworking applications, depending on the required bonding and heat-resistance characteristics.
  4. Textile and Carpet Adhesives. The flexibility provided by its relatively high VA content makes VA900 suitable for selected textile and carpet adhesive systems where flexible bonding is required.
  5. Industrial Hot Melt Adhesives. The material can also be used in industrial adhesive formulations requiring fast melting, good flow, and efficient application. Final suitability depends on the substrate, formulation, processing temperature, and performance requirements.

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